Reference Information

Chip Information

Component Sizes

Packages

Solder Paste

Solder paste (or solder cream) is a material used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through hole pin in paste components by printing solder paste in/over the holes. The paste initially adheres components in place by being sticky, it is then heated (along with the rest of the board) melting the paste and forming a mechanical bond as well as an electrical connection. The paste is applied to the board by jet printing, stencil printing or syringe and then the components are put in place by a pick-and-place 

Soldering using Solder Past

• First apply solder paste just enough to cover solder pads.
• Now place the IC on it.
• Hold it in place with tweezers and use a Hot air gun to solder it
• Temperature Should be around 315C (~600F)

References