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Chip Information

AcronymDefinition
SMDSurface Mount Device
THTThrough Hole Technology



Component Sizes

NumberSize
06030.06" x 0.03"
08050.08" x 0.05"
12060.12" x 0.06"
12100.12" x 0.10"
20100.20" x 0.10"
25120.25" x 0.12"


Packages

PackageDefinitionImage
SOP

Small Outline Package

Image result for sop package

TQFPThin Quad Flat Package

Image result for TQFP package


References

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